Semiconductor

💻 Semiconductor Process Chamber Components

Large diameter rings, liner shields, focus rings, clamp rings, gas distribution plates — thin-wall, high-purity

Design Principles

Material: Grade 2 (CP-Ti) is preferred for chamber components due to its low sputter yield and minimal particle generation in plasma environments. Grade 5 for structural rings.

Form: Plate stock for large diameter rings and shields. Tube for gas distribution lines. Bar for fasteners.

Engineering Trends

  • ▸ Process: CNC turning/boring of rings
  • ▸ Process: Precision drilling of gas holes
  • ▸ Process: Surface treatment (anodizing)

Components in This System

Titanium Ion Implantation Electrode

Ion extraction electrode disk for implanter

Titanium Lithography Stage Flexure

Monolithic flexure mount for lithography mirror stage

Titanium Wafer Handling End-Effector

Robot end-effector vacuum pad for wafer handling

Related Capabilities

CNC turning/boring of rings Precision drilling of gas holes Surface treatment (anodizing)

Standards Reference

Standards: ASTM B265 Grade 2, double-melted (VAR), electropolished, Class 10 cleanroom packaged, particle count certified

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Knowledge Graph

Semiconductor

Industry

💻 Semiconductor Process Chamber Components

System

🔩 Components

3 parts

⚙️ Capabilities

3 related

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