Semiconductor
๐ก Plasma Chamber Liners, Shields & Thermal Hardware
Rough-bead-blasted chamber wall liners, exhaust plenum baffle plates, ceramic heater clamping plates, slit-valve protection shunts, shield stand-off bushings, threaded blind studs, arc-shaped shadow ring brackets, RF grounding spring fingers, thermocouple shielding caplets
What is Plasma Chamber Liners, Shields & Thermal Hardware?
๐ก Plasma Chamber Liners, Shields & Thermal Hardware represents a complete system of precision titanium components engineered for Semiconductor applications. Rough-bead-blasted chamber wall liners, exhaust plenum baffle plates, ceramic heater clamping plates, slit-valve protection shunts, shield stand-off bushings, threaded blind studs, arc-shaped shadow ring brackets, RF grounding spring fingers, thermocouple shielding caplets The system integrates 8 distinct component types manufactured through 3 specialized processes.
Key manufacturing processes for this system include Cleanroom CNC Class 100 for chamber shield geometry, Electropolish Ra <0.25um at 200W fiber laser, UHP DI water cascade rinse at 200W fiber laser, Particle count MIL-STD-1246 at 200W fiber laser, Electropolish Ra <0.25um with 0.5mm corner radius, each selected and qualified to meet component-specific requirements.
Engineering & Design Principles
Material: Grade 2 (CP-Ti) for plasma liners, baffles, and shields โ excellent plasma erosion resistance and film adherence with bead-blasted surface. Grade 5 for clamping plates, shadow ring brackets, and studs
Form: Plate/sheet for liners, baffles, and shields via waterjet/laser cutting + forming. Bar for stand-offs and studs. Wire forming for spring fingers. Bead blasting of plasma-facing surfaces for film adhes
Standards & Material Specifications
Standards: ASTM B265 Grade 2 (liners) / ASTM B348 Grade 5 (hardware), bead-blasted plasma face, Class 100 cleaned
Engineering Solution Blueprint
Semiconductor Process Chamber Components
Semiconductor
1 Part Feature Analysis
Large diameter rings, liner shields, focus rings, clamp rings, gas distribution plates โ thin-wall, high-purity
- โ ๏ธ Plasma erosion
- โ ๏ธ Particle generation
- โ ๏ธ Metal contamination of wafers
- โ ๏ธ Thermal uniformity
- โ ๏ธ Cost of frequent replacement
2 Material Selection Rationale
Grade 2 CP-Ti โ Industrial pure Ti, general corrosion resistance
Grade 2 (CP-Ti) is preferred for chamber components due to its low sputter yield and minimal particle generation in plasma environments. Grade 5 for structural rings.
3 Form Selection Rationale
Plate / Sheet โ for welding, machined housings
Plate stock for large diameter rings and shields. Tube for gas distribution lines. Bar for fasteners.
4 Manufacturing Process & Services
Core Processes:
Toll Processing Services:
Process Pitfalls:
- โ ๏ธ Gas distribution hole diameter tolerance +-0.01mm required for uniform plasma
- โ ๏ธ All surfaces must be electropolished to Ra<0.4um to minimize particle generation
5 Procurement Specifications
ASTM B265 Grade 2, double-melted (VAR), electropolished, Class 10 cleanroom packaged, particle count certified
Manufacturing Process Flow
Titanium anodizing (AMS 2488) grows a controlled oxide layer through electrochemical conversion in an electrolyte bath. Type II produces interference
5-axis CNC milling centers provide simultaneous multi-axis interpolation for complex titanium components. The ability to tilt the tool relative to the
Fiber laser cutting of titanium uses a focused 1 ยตm wavelength beam to melt and expel material through a coaxial assist gas jet. The narrow (0.1โ0.3 m
Components in This System
| Component | Material |
|---|---|
| Titanium Ceramic Heater Clamp Plate | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Chamber Liner (Upper) | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Exhaust Baffle Plate | Grade 2 CP-Ti (Bead Blasted) |
| Titanium RF Grounding Spring Finger | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Shield Stand-off Bushing | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Shadow Ring Bracket | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Slit-Valve Protection Shunt | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Threaded Blind Stud (Interior) | Grade 2 CP-Ti (Bead Blasted) |
Frequently Asked Questions
What titanium grades are used in Plasma Chamber Liners, Shields & Thermal Hardware systems?
What manufacturing processes are used for Plasma Chamber Liners, Shields & Thermal Hardware?
What quality standards apply to Plasma Chamber Liners, Shields & Thermal Hardware components?
What industries use Plasma Chamber Liners, Shields & Thermal Hardware?
Can you provide DFM feedback for Plasma Chamber Liners, Shields & Thermal Hardware designs?
Engineering Trends
- โธ Process: Waterjet/laser cutting of liner profiles
- โธ Process: Bead blasting of plasma-facing surfaces
- โธ Process: CNC machining of clamping plates and brackets
Related Manufacturing Capabilities
These specialized processes support Plasma Chamber Liners, Shields & Thermal Hardware component manufacturing.
One Metal. One Focus. Infinite Precision.
Founded in 2011 in Baoji's Titanium Valley, BOZE Metal is dedicated exclusively to titanium โ from raw material to precision engineering. AS9100D, ISO 13485 & ISO 9001 certified with 500+ clients across Aerospace, Medical & Motorsport industries, we deliver end-to-end precision titanium CNC machining with full material traceability from source to component.
Boze Titanium Manufacturing Center is operated by Baoji Boze Metal Products Co., Ltd.