Precision Titanium Machining for AI Infrastructure & Optical Communications
High-precision custom titanium component manufacturing engineered to eliminate thermal drift, prevent liquid cooling leakage, and deliver absolute EMI shielding for high-density compute nodes and 800G/1.6T optical transceivers.
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精密CNCフライス加工 — 薄肉EMIシールドを備えた800G/1.6T光トランシーバハウジング
800Gおよび1.6T光トランシーバ向け高精密チタン光電子エンクロージャ。薄肉ポケット加工（0.4mm壁厚）と電磁干渉（EMI）シールドにより、レーザー溶接対応パッケージ内のデバイス動作を保護します。
800G/1.6Tトランシーバハウジングフライス加工
精密CNC · 薄肉0.4mm · EMIシールド800Gおよび1.6Tで動作する光トランシーバには、薄肉ポケットと一体型EMIシールド構造を備えたハウジングが必要です。チタンは導電性のある筐体として機能し、チタンの自然酸化層による耐食性を維持しながら、追加のシールド材なしでEMIを抑制します。
技術実装- 壁厚0.4mmまでの薄肉ポケット加工 — 導電性コーティング不要で自然なEMIシールドを実現
- 低CTE（8.6 ppm/°C）により、0-70°Cの動作範囲で光学的位置ずれを排除
- クロストーク分離壁を一体加工 — 隣接チャンネル間の信号干渉を排除
ファイバアライメントと気密封止
±0.005mm位置決め · レーザー溶接対応ファイバフィードスルー位置決めとシール面の共平面性が、トランシーバアセンブリ内の光結合効率を直接決定します。チタンの寸法安定性と加工性により、厳しい位置公差が可能となり、レーザー溶接気密封止との互換性を確保します。
技術実装- シール面共平面性 ≤ 0.01mm — 業界規格あたりのレーザー溶接気密封止を実現
- ファイバフィードスルー穴位置決め ±0.005mm — コア間の光結合を保証
- グレード2およびグレード5チタンオプション — 特定の光学部品のCTE要件に適合
Multi-Axis CNC Machining — Liquid Cooling Manifolds, Cold Plates & Quick-Disconnect Valves
High-precision titanium liquid cooling manifolds and cold plates for AI GPU/ASIC clusters. Corrosion-free fluid channels machined from Grade 5 Titanium — engineered for leak-proof operation under relentless thermal cycling.
Liquid Cooling Manifolds & Cold Plates
Multi-Axis CNC · Grade 5 Ti · GPU/ASIC ClustersAI training clusters generate heat densities exceeding 1000 W per GPU demanding direct-to-chip liquid cooling with absolute reliability. Our multi-axis CNC machining produces titanium manifolds and cold plates with optimized micro-channel geometries.
Technical Implementation- Micro-channel geometry optimized for maximum heat transfer at coolant pressures up to 10 bar
- Titanium's natural corrosion resistance eliminates galvanic reactions with dielectric coolants
- Single-piece manifold construction eliminates potential leak paths from multi-part welded assemblies
Quick-Disconnect Valve & Fitting Manufacturing
Ra ≤ 0.4 µm Sealing · Helium Leak TestedData center liquid cooling loops require quick-disconnect valves and fittings that maintain zero-leak performance across thousands of mate-demate cycles. Our precision-turned titanium valve bodies achieve Ra ≤ 0.4 µm sealing surface finishes.
Technical Implementation- Sealing surface finish Ra ≤ 0.4 µm — ensures leak-proof O-ring sealing across temperature range
- Thread forms per ASME B1.1 — consistent preload for thousands of connect-disconnect cycles
- 100% helium leak testing available — verified to < 1×10⁻⁹ mbar·L/s for critical cooling loops
CMM Dimensional Validation — GD&T Coplanarity & Geometric Alignment for Optical Sub-Assemblies
Absolute dimensional verification via CMM mapping to ASME Y14.5 GD&T standards guaranteeing coplanarity, flatness, and positional accuracy for high-yield fiber alignment in optical transceiver sub-assemblies.
CMM for Optical Component Verification
ZEISS CMM · ±1.9 µm · ASME Y14.5 GD&TOptical transceiver housings and liquid cooling manifolds demand micron-level geometric precision. Our ZEISS CMM platforms measure flatness, parallelism, true position, and profile tolerances across all sealing surfaces.
Technical Implementation- ZEISS CMM ±1.9 µm volumetric accuracy — ISO 17025 traceable calibration for optical components
- Sealing surface coplanarity ≤ 0.01 mm — ensures consistent laser weld hermeticity
- Full GD&T reporting per ASME Y14.5 — flatness, parallelism, profile, true position on every lot
GD&T for High-Yield Assembly
True Position ±0.01mm · Flatness ≤0.005mm/25mmSub-micron geometric tolerances on optical transceiver housings directly determine optical coupling efficiency and manufacturing yield. Our GD&T verification culture ensures every component meets ASME Y14.5 specifications.
Technical Implementation- True position ≤ ±0.01 mm for fiber array and laser diode mounting features
- Surface flatness ≤ 0.005 mm per 25 mm — ensures PCB and sub-mount seating without stress
- SPC trending for production monitoring — early detection of tool wear or thermal drift
100% Material Traceability — EN 10204 3.1 MTR & Heat Number Tracking for Mission-Critical Infrastructure
Every AI infrastructure component is backed by EN 10204 3.1 Mill Test Reports and laser-marked heat numbers validating metallurgical purity to prevent invisible micro-cracks in 24/7 data center server matrices.
EN 10204 3.1 MTR & Heat Number
Every batch of Grade 2, Grade 5, and specialty titanium is certified with EN 10204 Type 3.1 documentation verifying chemical composition and mechanical properties.
- Chemical composition per ASTM B265/B348 — verified for purity and interstitial element control
- Laser-marked heat number on each component — permanent traceability to mill certification
- Digital MTR archive — full traceability chain from raw material to finished component
Reliability for 24/7 Uptime
Data center cooling and optical infrastructure operates 24/7/365 — component failure is not an option. Our strict material verification and processing controls eliminate the risk of invisible micro-cracks or metallurgical defects.
- 100% material verification before machining — eliminates hidden defects in critical cooling paths
- Dye penetrant inspection available — verifies surface integrity on pressure-containing components
- Full traceability chain — raw material heat lot to machining to cleaning to delivery
認定済み
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